TEF’s five SMT assembly lines are equipped with an AOI (Automated Optical Inspection) system that performs 3D verification of the components placed on the electronic assembly.
In addition, two of these assembly lines also have SPI (Solder Paste Inspection) equipment, which performs a three-dimensional analysis after screen printing the PCBA.
For PCBs with BGA components and others, we have a state-of-the-art X-ray inspection machine.
PCBAs that incorporate BGA components, among others, must undergo X-ray inspection once soldered to verify that each element is in place and that everything will function correctly. At TEF, we perform 3D inspection of these parts for the following purposes:
TEF’s PCB verification service includes sending all photographs taken to the customer. We prepare a comprehensive report with detailed images so that the customer can see the layout of the welds, voids, etc. This is how we guarantee complete transparency throughout the process.
Schedule an appointment with us to have your PCBs checked.
